TL; DR
- New alleged renders of the Vivo X70 Pro Plus have surfaced.
- The pictures describe the key features of the phone, including a huge quad camera hump and a distinctive design.
Earlier this week, renders of the upcoming Vivo X70 Pro broke cover. Now new leaks and renderings related to the Vivo X70 Pro Plus have appeared.
The details come from Price baba and tipster Steve Hemmerstoffer and provide further insights into the phone’s core specifications and overall design.
Let’s talk about this design. The front of the Vivo X70 Pro Plus has a large 6.7-inch curved AMOLED display with a punch-hole camera. It seems reasonable not to include an under-display camera as a phone series that puts camera performance over aesthetics.
Speaking of which, there’s a sizeable camera hump on the back, showing three sensors in a vertical line and another to the right of the lower lens. The clearly visible Zeiss branding is also on the back. Overall, the hump is 2.3mm thick, adding to the already chunky 9mm of the phone itself. The Vivo X70 Pro Plus should also be 164.8 mm long and 75.5 mm wide. Similar to the Xiaomi Mi 11 Ultra, the accent of the camera bump extends over the top third of the phone. There is no indication of a second screen, however.
There is a power button and volume rocker on the right side of the device, while the bottom houses a single speaker grille and USB-C port.
The renders don’t reveal much in terms of specs, but the phone is said to have a Snapdragon 888 SoC, at least 8 GB of RAM, and a Full HD + screen resolution.
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